Modular Chiplet Opportunities for High-Performance Computing
Explore how chiplet-based specialized accelerators can revolutionize High-Performance Computing (HPC) systems to overcome Moore's Law limitations and deliver enhanced scientific computing performance.
Getting Moore with Less - How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
Explore how chiplet technology and open interconnect standards revolutionize AI silicon design, offering solutions to overcome semiconductor scaling limitations and advance high-performance computing.
CXL Device Telemetry - A Software Interface Proposal
Explore a standardized software interface proposal for accessing and analyzing CXL device telemetry data, focusing on improving application performance and memory management.
The Next Wave of Computing with Optical I/O - Scaling AI and Cloud Computing Performance
Discover how optical I/O and photonic solutions revolutionize data center performance, enabling higher bandwidth and lower latency for AI, HPC, and cloud computing through advanced chiplet technology.
Compute Express Link (CXL): Advancing Coherent Connectivity
Discover how CXL 3.0 enhances system architecture through advanced switching, memory pooling, and fabric capabilities for optimized computational infrastructure performance.
Introduction to CXL Fabrics - Multi-level Switch Architecture and Scaling
Explore CXL Fabrics' multi-level switch architecture, including transport details, routing models, and management systems for scaling up to 4,096 nodes in flexible network topologies.
Enabling CXL Within the Data Center with ARM Solutions
Discover how Compute Express Link (CXL) technology transforms data center architecture, focusing on Arm's innovative solutions for enhanced memory and device connectivity.
HPC: The Next Generation - A Sustainable Energy-Centric Architecture Innovation
Explore revolutionary sustainable computing architecture that replaces traditional 19" racks with efficient "Wall of Compute" systems, featuring direct water cooling and scalable High Performance Compute Modules.
Memory Scalability in AI Co-Design Using CXL Technology
Explore memory and storage architecture innovations for AI systems, focusing on CXL technology's role in enabling efficient data sharing and scalable memory solutions for large-scale AI workloads.
Modeling Methodology and Tools for Hardware-Software Codesign
Explore methodologies and tools for optimizing AI systems through hardware-software co-design, focusing on emerging challenges in large language models and generative AI architectures.
Architectural Challenges and Innovation for Compute Infrastructure Co-Design in Generative AI
Explore architectural solutions for generative AI computing challenges, focusing on heterogeneous computing infrastructure and chiplet-based systems for improved energy efficiency.
Photonics-Based Resource Disaggregation for HPC
Discover how photonics-based resource disaggregation can revolutionize high-performance computing systems, exploring innovative approaches to enhance data center efficiency and scalability.
The Future of AI/ML Innovation Through Row-Scale Disaggregation
Explore how Composable Disaggregated Infrastructure revolutionizes system architecture for AI/ML applications through innovative network fabric design and extended PCIe capabilities.
Advanced Packaging Technologies for Chiplet Adoption and Memory Integration in HPC and AI Applications
Explore cutting-edge packaging technologies and chiplet design innovations for next-generation AI and HPC systems, including D2D protocols, hybrid copper bonding, and photonic integration.
UCIe - Universal Chiplet Interconnect Express for Die-to-Die Integration
Discover how UCIe 1.0 standardizes die-to-die interconnects for high-performance computing, enabling efficient integration of heterogeneous processing units and on-package memory for AI, ML, and cloud computing.
Chiplet-Based Compressed LLC Cache and Memory Expansion for Data Centers
Explore hardware-accelerated chiplet technology for real-time memory compression, enabling cost-effective cache expansion and improved data center performance through innovative architectural solutions.
Analog In-Memory Computing with Multilevel Memristive Devices for High Performance Computing
Discover how multilevel memristive devices revolutionize computing by enabling analog in-memory processing, boosting throughput and energy efficiency for deep learning applications and high-performance computing.
Secure System Boot Architecture and Protocols for OCP Flashless Boot
Explore the architecture and protocols of OCP Flashless Boot, including system boot processes, PCIe device booting, and future adoption roadmap for secure computing infrastructure.
Chiplet-based Reconfigurable Open Compute Accelerator Module Architecture and Platform
Explore the innovative Chiplet-based Reconfigurable OAM platform, focusing on system packaging, standardization, and modular design for advanced accelerator solutions and microservices deployment.
How Chiplets Are Transforming the Semiconductor Ecosystem - From Design to Packaging
Explore how chiplet technology revolutionizes semiconductor design, enabling modular integration for enhanced computing performance and system-level efficiency in modern computing architectures.
Quantum Computers and Simulators in High-Performance Computing Centers
Explore the integration of quantum computing with HPC systems, focusing on user requirements, technological challenges, and ongoing European and global R&D initiatives.