Advanced Packaging Technologies for Chiplet Adoption and Memory Integration in HPC and AI Applications
Explore cutting-edge packaging technologies and chiplet design innovations for next-generation AI and HPC systems, including D2D protocols, hybrid copper bonding, and photonic integration.
Power Delivery Challenges for AI Accelerators - Advancements and Development of High Density Solutions
Explore power delivery challenges in AI accelerators and innovative solutions for high-density power modules, focusing on AMD Mi300X's vertical stacking and ecosystem standardization.
Securing System-in-Packages with Physical Unclonable Functions (PUF) Technology
Discover how Physical Unclonable Functions (PUF) technology enhances security in System-in-Package designs, providing robust protection against hardware-based attacks and counterfeiting.
Hacking Learning Codes in Car Key Fobs - Hardware Security Analysis
Discover how hardware hacking techniques expose vulnerabilities in car key systems by analyzing learning codes, using logic analyzers and SDR tools to duplicate signals and gain unauthorized access.
Democratising Chip Design with Open Source
Explore open-source chip design democratization with Rob Taylor, uncovering its potential to revolutionize the semiconductor industry and foster innovation.
Universal Chiplet Interconnect Express - Building an Open Ecosystem of Chiplets
Discover how UCIe technology enables mixing chiplet components from multiple vendors for customized System-on-Chip construction, addressing growing compute demands across various sectors.
Chip-let Interconnect Test and Repair
Explore advanced techniques for testing and repairing chip-let interconnects, focusing on practical solutions and emerging methodologies in semiconductor manufacturing.
The Challenges of Scaling Beyond Moore's Law - From Monolithic Dies to 3D Heterogeneous Integration
Explore the shift beyond Moore's Law into 3D heterogeneous integration, examining technical challenges, economic factors, and emerging solutions in semiconductor design and packaging.
Signal Integrity Analysis for 2.5D/3D IC Technology in the Interposer Era
Delve into signal integrity analysis challenges and solutions for 2.5D/3D IC technology, focusing on silicon interposers, electromagnetic simulation, and advanced packaging architectures.
Solving Moore's Law Packaging Challenges Through Next-Generation Materials and 3D Integration
Explore advanced semiconductor packaging solutions addressing Moore's Law limitations through heterogeneous integration, 3D stacking, and innovative copper interconnect materials for enhanced performance and miniaturization.
Novel Techniques for IC Integration and Packaging Using Additive Technologies
Explore innovative Flexible Hybrid Electronics manufacturing techniques combining thinned dies, printed components, and flexible materials to revolutionize electronics packaging and system integration.
Infrastructure and Applications for AI in Semiconductor Test
Explore cutting-edge AI applications and infrastructure developments in semiconductor testing, focusing on optimization and efficiency improvements in manufacturing processes.
Implementing Real-time AI in High Volume Test
Discover practical strategies for implementing AI solutions in high-volume semiconductor testing environments, focusing on real-time applications and efficiency optimization.
Nano Enigma: Uncovering the Secrets in eFuse Memories
Dive into the fascinating world of eFuse memory security, exploring physical extraction techniques from basic decapsulation to advanced SEM analysis for accessing encrypted data storage.
Unlocking Hardware Security - Red Team, Blue Team, and Trojan Tales
Explore hardware Trojan detection in ICs through a Red Team vs. Blue Team case study. Learn about imaging techniques, algorithm efficiency, and the impact of technology scaling on security.
Connectivity for AI Everywhere - The Role of Chiplets
Explore how chiplet technology revolutionizes AI connectivity and enables distributed computing solutions through advanced semiconductor integration and interconnect strategies.
Heterogeneous Integration and Chiplet Manufacturing in the US - A Technical Overview
Explore the chiplet technology landscape and advanced packaging developments in US manufacturing, focusing on heterogeneous integration, industry standards, and assembly processes.
Universal Chiplet Interconnect Express (UCIe) 2.0 Specification - Technology Overview and Updates
Explore the latest developments in UCIe technology, including specification improvements, automotive enhancements, and the future of chiplet interconnect systems with industry expert Debendra Das Sharma.
AttackGNN: Red-Teaming GNNs in Hardware Security Using Reinforcement Learning
Discover how reinforcement learning can generate adversarial examples to challenge GNN-based hardware security systems, demonstrating vulnerabilities in IP piracy detection and Trojan identification methods.