Signal Integrity Analysis for 2.5D/3D IC Technology in the Interposer Era
Save Big on Coursera Plus. 7,000+ courses at $160 off. Limited Time Only! Grab it Learn about signal integrity analysis challenges and solutions in the era of silicon interposers through this 34-minute technical presentation from MEPTEC. Explore how high-performance computing, AI processors, and CPU/GPU advancements drive the need for 2.5D/3D IC technology and advanced packaging approaches. Discover why traditional design methodologies must evolve to meet aggressive performance goals through co-simulation of die, interposer, package, and PCB components. Examine the unique challenges posed by silicon interposers, including silicon density, high speeds, through-silicon vias, and long-distance signaling. Understand the importance of early collaboration between design teams and how Ansys' multiphysics solutions, advanced workflows, and electromagnetic solvers address complex SI issues in silicon interposer architecture. Follow detailed technical discussions covering IC market trends, heterogeneous design approaches, RaptorH capabilities, analytical modeling, case studies, and system optimization techniques for successful 2.5D/3D-IC product development. Read more