Precise Synchronization and Advanced Performance in Open RAN and 5G Deployments
Discover how to implement precise time synchronization in Open RAN and 5G networks using SONiC and LinuxPTP, enabling carrier-grade performance while maintaining network flexibility and virtualization capabilities.
Synchronizing the Future with Precision Time Measurement and Time-Aware GPIO on Intel Hardware
Discover how Intel's Precision Time Measurement and Time-Aware GPIO technologies enhance timing accuracy for FinTech and Telco industries, with implementation insights for hardware and firmware integration.
The Path for Next Generation Optics - Data Center Solutions and Sustainability
Discover cutting-edge developments in optical networking technology, focusing on protocol-agnostic specifications, energy efficiency, and solutions optimized for AI/ML workloads in modern data centers.
Thermal Characterization of High-Power Pluggable Optical Modules
Explore thermal management challenges and solutions for high-power optical modules, focusing on alternative methodologies beyond traditional case temperature measurements for next-gen transceivers.
CXL-Enabled Heterogeneous Active Memory Tiering: Architecture and Implementation
Explore CXL Type2-based disaggregated memory architecture and how it extends far memory to remote heterogeneous memory using ethernet, featuring intelligent fabric control and memory tiering.
Card Edge Interconnects - Understanding Device and Riser Card Connectivity Tradeoffs
Dive into card edge interconnect solutions, exploring configuration options, mechanical robustness, and signal integrity across various device form factors, with focus on PCIe Gen 5/6 and CXL implementation.
Open Compute Project OSFCI Workshop: From Basic Usage to Advanced Automation
Master OSFCI tool fundamentals, from basic testing to advanced API automation, custom firmware builds, and deployment strategies for efficient continuous integration workflows.
Multi-wavelength Technology for Scalable and Reliable Optical Compute Interconnects
Discover how multi-wavelength technology enables scalable optical compute interconnects, exploring innovations in reliability and performance for next-generation data center architectures.
Architectural Challenges and Innovation for Compute Infrastructure Co-Design in Generative AI
Explore architectural solutions for generative AI computing challenges, focusing on heterogeneous computing infrastructure and chiplet-based systems for improved energy efficiency.
M-CRPS Compatible Totem-Pole Bridgeless PFC with Re-Rush Current Control and Low iTHD
Explore advanced power supply design techniques for data centers, featuring high-density PFC solutions with enhanced efficiency, reliability, and innovative control algorithms for improved performance.
Advanced Packaging Technologies for Chiplet Adoption and Memory Integration in HPC and AI Applications
Explore cutting-edge packaging technologies and chiplet design innovations for next-generation AI and HPC systems, including D2D protocols, hybrid copper bonding, and photonic integration.
High-Heat-Flux Rack Level Direct-to-Chip Two-Phase Cooling Using Sustainable Fluids
Explore sustainable cooling solutions for data centers through direct-to-chip two-phase cooling technology using R1336mzz(Z), a low global warming potential fluid alternative to R134a.
Enabling Synchronization for Seamless Integration of Data Centers in 5G
Dive into advanced synchronization techniques for integrating data centers with 5G networks, focusing on holdover capabilities and tight synchronization requirements.
Environmental Impact Analysis of Air and Liquid Cooled Servers - Choosing the Right Cooling Technology
Explore the environmental impact comparison between air and liquid-cooled server systems across different locations, focusing on carbon emissions and sustainability considerations.
Breaking the Barrier: Chip Level Cooling Up to and Beyond 1000W in Single Phase Dielectric Fluid
Discover groundbreaking advancements in single-phase dielectric fluid cooling technology for data centers, achieving unprecedented 1000W+ chip-level cooling capabilities for AI applications.
Ceramic Nano Memory - Enabling the AI Storage Dataverse
Discover how Ceramic Nano Memory revolutionizes data storage with sustainable, high-density solutions using inorganic nanolayers on glass, enabling fast access and scalability for AI-driven data centers.
Infrastructure Utilization Efficiency Metrics for Data Center Sustainability
Explore new metrics for measuring data center efficiency, focusing on Infrastructure Utilization Efficiency (IUE) and its relationship with power consumption, thermal performance, and sustainability readiness.
Enhancing Telecommunications for Sustainable and Efficient Central Offices
Discover strategies for optimizing central offices in telecom networks through sustainable practices, energy-efficient solutions, and innovative data center design principles for reduced environmental impact.
Increasing Energy Efficiency of Server Cooling Using Deep Reinforcement Learning
Discover how Deep Reinforcement Learning optimizes server cooling efficiency, reducing fan energy usage by 40% and achieving 8% overall server energy savings through intelligent thermal management.
Recovery from Firmware Vulnerabilities in TPM - Securing Hardware Roots of Trust
Discover how new TPM specification APIs enable firmware vulnerability recovery and self-attestation capabilities, enhancing hardware security and trust restoration mechanisms.
OpenRAN and Open Radio Platform - A Strategic Implementation Overview
Discover CapGemini's strategic approach to Open RAN adoption, exploring ecosystem partnerships, implementation strategies, and the evolution of telecommunications infrastructure.