SK hynix CXL Disaggregated Memory Solution
Explore cutting-edge memory disaggregation technology with SK hynix's CXL solution, focusing on innovative approaches to memory expansion and resource optimization in data centers.
A Software Stack for CXL Memory Environments - Architecture and Management
Explore the software ecosystem and architecture for CXL environments, covering management tools, orchestration capabilities, and telemetry implementation for memory-centric computing.
Introduction to CXL Fabrics - Multi-level Switch Architecture and Scaling
Explore CXL Fabrics' multi-level switch architecture, including transport details, routing models, and management systems for scaling up to 4,096 nodes in flexible network topologies.
CXL 2.0 Switch Enabling Composable Memory Architecture in AI and HPC Computing
Explore the role of CXL 2.0 switching technology in enabling flexible memory architectures for advanced AI and high-performance computing systems.
Enabling CXL Within the Data Center with ARM Solutions
Discover how Compute Express Link (CXL) technology transforms data center architecture, focusing on Arm's innovative solutions for enhanced memory and device connectivity.
Card Edge Interconnects - Understanding Device and Riser Card Connectivity Tradeoffs
Dive into card edge interconnect solutions, exploring configuration options, mechanical robustness, and signal integrity across various device form factors, with focus on PCIe Gen 5/6 and CXL implementation.
HPC: The Next Generation - A Sustainable Energy-Centric Architecture Innovation
Explore revolutionary sustainable computing architecture that replaces traditional 19" racks with efficient "Wall of Compute" systems, featuring direct water cooling and scalable High Performance Compute Modules.
Open Compute Project OSFCI Workshop: From Basic Usage to Advanced Automation
Master OSFCI tool fundamentals, from basic testing to advanced API automation, custom firmware builds, and deployment strategies for efficient continuous integration workflows.
Unleashing the Full Potential of CXL Memory Technology in Data Centers
Discover how CXL technology revolutionizes data center memory expansion, enabling enhanced performance for AI applications through composable architectures and optimized resource utilization across computing components.
Memory Scalability in AI Co-Design Using CXL Technology
Explore memory and storage architecture innovations for AI systems, focusing on CXL technology's role in enabling efficient data sharing and scalable memory solutions for large-scale AI workloads.
Scalability of Memory Subsystem in AI Storage Systems - IO Profiling and Performance Analysis
Explore IO profiling in AI systems, examining pipeline stages, metadata costs, and filesystem latency impacts on GPU performance, with solutions for optimizing storage systems.
Optical Interconnect - Pathways to an Open Infrastructure for AI
Explore the future of AI infrastructure through optical interconnect technology and its potential for creating more efficient, open systems for artificial intelligence applications.
Modeling Methodology and Tools for Hardware-Software Codesign
Explore methodologies and tools for optimizing AI systems through hardware-software co-design, focusing on emerging challenges in large language models and generative AI architectures.
Ultra Low-Power, High-Density Parallel MicroLED Optical Links
Explore groundbreaking microLED optical link technology offering unprecedented power efficiency, bandwidth density, and low latency for next-generation network communications.
Architectural Challenges and Innovation for Compute Infrastructure Co-Design in Generative AI
Explore architectural solutions for generative AI computing challenges, focusing on heterogeneous computing infrastructure and chiplet-based systems for improved energy efficiency.
Photonics-Based Resource Disaggregation for HPC
Discover how photonics-based resource disaggregation can revolutionize high-performance computing systems, exploring innovative approaches to enhance data center efficiency and scalability.
The Future of AI/ML Innovation Through Row-Scale Disaggregation
Explore how Composable Disaggregated Infrastructure revolutionizes system architecture for AI/ML applications through innovative network fabric design and extended PCIe capabilities.
BBCube 3D - Heterogeneous 3D Integration for TB/s Bandwidth in AI and HPC Applications
Discover groundbreaking BBCube 3D technology for heterogeneous integration, offering enhanced bandwidth and energy efficiency through innovative stacking processes and TSV implementation for AI/HPC applications.
Advanced Packaging Technologies for Chiplet Adoption and Memory Integration in HPC and AI Applications
Explore cutting-edge packaging technologies and chiplet design innovations for next-generation AI and HPC systems, including D2D protocols, hybrid copper bonding, and photonic integration.
Advances in Quantum Interconnect Technology for Communication Networks
Explore cutting-edge quantum communication technologies and ultra-low loss optical interconnects powering next-generation quantum networks and quantum key distribution systems.
Low-Loss Connections to Optical Fibers for Quantum Photonic Integrated Circuits
Discover groundbreaking fiber-optic connections for quantum photonic circuits, featuring low-loss metallic connectors and expanded-beam paths suitable for cryogenic environments and multiple PIC platforms.