Addressing Future Thermal Challenges Driven by AI - Data Center Cooling Solutions

Addressing Future Thermal Challenges Driven by AI - Data Center Cooling Solutions

Learn about GPU evolution and power management challenges in AI computing through this 24-minute conference talk from Lenovo at the Open Compute Project. Explore the transformation from theoretical concepts to practical applications in thermal management, including detailed insights into Cold Plate Design, QD and Manifold implementations, and Facility Standards. Discover Lenovo's history of thermal innovation, current trends in liquid cooling, and critical challenges facing AI deployment at both rack and room levels. Gain valuable understanding of where thermal management is heading and what factors are most crucial for addressing future AI-driven thermal challenges.