Dielectric Cold Plate-based Modular Data Center Solutions for Efficient Computing
Watch a technical presentation exploring two prefabricated modular data center designs that utilize direct-on-chip dielectric liquid cooling systems. Learn about a 1MW configuration optimized for high-performance computing with efficient heat reuse capabilities and 65°C water outlet temperatures, as well as a 350kW waterless solution ideal for telecommunications applications. Examine how these all-in-one containerized solutions integrate IT equipment, power infrastructure, cooling systems, and facility structures into plug-and-play computing units that can function independently or as building blocks within larger data centers. Presented by Shahar Belkin, EVP Product at ZutaCore Ltd., this talk builds on previously published whitepaper findings to demonstrate innovative approaches to data center cooling and modular deployment.