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    Microelectronics

    21 курсов
    Devices to Circuits
    IIT Roorkee July 2018

    Devices to Circuits

    Deep Submicron Backdoor - SyScan'14 Singapore
    SyScan360

    Deep Submicron Backdoor - SyScan'14 Singapore

    Surface Mount Soldering Techniques for Electronics - Part 3
    Branchus Creations

    Surface Mount Soldering Techniques for Electronics - Part 3

    Application of Scattering Parameters to DPL Time-Lag Parameter Estimation Using MEMS Structures
    HyperComplex Seminar

    Application of Scattering Parameters to DPL Time-Lag Parameter Estimation Using MEMS Structures

    Introduction to MOSFET - Lecture 9.1
    NPTEL-NOC IITM

    Introduction to MOSFET - Lecture 9.1

    MOS Capacitances in NMOS Transistors - Lecture 1.5
    NPTEL-NOC IITM

    MOS Capacitances in NMOS Transistors - Lecture 1.5

    Introduction to Digital IC Design
    NPTEL-NOC IITM

    Introduction to Digital IC Design

    CMOS Technology
    NPTEL-NOC IITM

    CMOS Technology

    The Active Load in CMOS Inverters - Continued
    NPTEL-NOC IITM

    The Active Load in CMOS Inverters - Continued

    Digital IC Design
    NPTEL-NOC IITM

    Digital IC Design

    Short Channel Current Model Analysis for MOS Transistors
    NPTEL-NOC IITM

    Short Channel Current Model Analysis for MOS Transistors

    NMOS Transistor Working - Lecture 1.3
    NPTEL-NOC IITM

    NMOS Transistor Working - Lecture 1.3

    Understanding Silicon for CMOS Transistor Design - Lecture 1.1
    NPTEL-NOC IITM

    Understanding Silicon for CMOS Transistor Design - Lecture 1.1

    Short Channel Current Model for MOS Transistors - Lecture 1.7
    NPTEL-NOC IITM

    Short Channel Current Model for MOS Transistors - Lecture 1.7

    MOSCAP Capacitance-Voltage (CV) Characteristics - Lecture 8.2
    NPTEL-NOC IITM

    MOSCAP Capacitance-Voltage (CV) Characteristics - Lecture 8.2

    Chip-let Interconnect Test and Repair
    HOTI - Hot Interconnects Symposium

    Chip-let Interconnect Test and Repair

    The Challenges of Scaling Beyond Moore's Law - From Monolithic Dies to 3D Heterogeneous Integration
    MEPTEC

    The Challenges of Scaling Beyond Moore's Law - From Monolithic Dies to 3D Heterogeneous Integration

    Enabling High Volume Data Communication - Solving Challenges in PIC Wafer Testing
    MEPTEC

    Enabling High Volume Data Communication - Solving Challenges in PIC Wafer Testing

    Packaging of Sensors for High Reliability, Survival and Performance in Extreme Environments
    MEPTEC

    Packaging of Sensors for High Reliability, Survival and Performance in Extreme Environments

    How Sand and Java Create the World's Most Powerful Chips
    Devoxx

    How Sand and Java Create the World's Most Powerful Chips

    AI on the Edge - Advancing Edge Computing and Next-Generation Networks
    USC Information Sciences Institute

    AI on the Edge - Advancing Edge Computing and Next-Generation Networks