Главная
Study mode:
on
1
Lecture 1: Introduction
2
Lecture 2: Introduction (Contd.)
3
Lecture 3: Introduction (Contd.)
4
Lecture 4: Introduction (Contd.)
5
Lecture 5: DFT
6
Lecture 6: DFT (Contd.)
7
Lecture 7: DFT (Contd.)
8
Lecture 8: DFT (Contd.)
9
Lecture 9: DFT (Contd.)
10
Lecture 10:DFT (Contd.)
11
Lecture 11: Logic and Fault Simulation
12
Lecture 12: Logic and Fault Simulation (Contd.)
13
Lecture 13: Logic and Fault Simulation (Contd.)
14
Lecture 14: Logic and Fault Simulation (Contd.)
15
Lecture 15: Logic and Fault Simulation (Contd.)
16
Lecture 16: Logic and Fault Simulation (Contd.)
17
Lecture 17: Test Generation
18
Lecture 18: Test Generation (Contd.)
19
Lecture 19: Test Generation (Contd.)
20
Lecture 20: Test Generation (Contd.)
21
Lecture 21: Test Generation (Contd.)
22
Lecture 22: Test Generation (Contd.)
23
Lecture 23: Test Generation (Contd.)
24
Lecture 24: Logic BIST
25
Lecture 25: Logic BIST (Contd.)
26
Lecture 26: Logic BIST (Contd.)
27
Lecture 27: Logic BIST (Contd.)
28
Lecture 28: Test Compression
29
Lecture 29: Test Compression (Contd.)
30
Lecture 30: Test Compression (Contd.)
31
Lecture 31: Test Compression (Contd.)
32
Lecture 32: Low Power Testing
33
Lecture 33: Low Power Testing (Contd.)
34
Lecture 34: Low Power Testing (Contd.)
35
Lecture 35: Low Power Testing (Contd.)
36
Lecture 36: Low Power Testing (Contd.)
37
Lecture 37 : Thermal Aware Testing
38
Lecture 38 : Thermal Aware Testing (Contd.)
39
Lecture 39 : Thermal Aware Testing (Contd.)
40
Lecture 40 : Boundary Scan
41
Lecture 41 : Boundary Scan (Contd.)
42
Lecture 42 : Boundary Scan (Contd.)
43
Lecture 43 : Boundary Scan (Contd.)
44
Lecture 44 : Boundary Scan (Contd.)
45
Lecture 45 : System/Network - On - Chip Test
46
Lecture 46 : System/Network - On - Chip Test (Contd.)
47
mod10lec47
48
mod10lec48
49
mod10lec49
50
mod10lec50
51
mod10lec51
52
mod11lec52
53
mod11lec53
54
mod11lec54
55
mod11lec55
56
mod11lec56
57
mod12lec57
58
mod12lec58
59
mod12lec59
60
mod12lec60
Description:
PRE-REQUISITES: Digital Design / Digital Logic INTENDED AUDIENCE: CSE, ECE, EE INDUSTRIES APPLICABLE TO: Companies involved in the development of VLSI chips COURSE OUTLINE: Testing is an integral part of the VLSI design cycle. With the advancement in IC technology, designs are becoming more and more complex, making their testing challenging. Testing occupies 60-80% time of the design process. A well structured method for testing needs to be followed to ensure high yield and proper detection of faulty chips after manufacturing. Design for testability (DFT) is a matured domain now and thus needs to be followed by all the VLSI designers. In this context, the course attempts to expose the students and practitioners to the most recent, yet fundamental, VLSI test principles and DFT architectures in an effort to help them design better quality products that can be reliably manufactured in large quantities.

Digital VLSI Testing

NPTEL
Add to list
0:00 / 0:00