Explore electronics e-cooling simulation techniques in this 50-minute webinar that demonstrates Fusion 360's electronics design and thermal analysis capabilities. Learn how to address heat-related issues that can degrade electronic device performance and reliability. Discover methods for analyzing power dissipation of ICs and power losses across circuit boards. Follow along as the presenter guides you through setting up critical temperatures, solving simulations, cloning designs, applying heat loads, incorporating heat sinks and fans, and interpreting results. Gain valuable insights into optimizing thermal management for electronic devices and enhancing overall product performance.