Explore a detailed 3D animation demonstrating signal loss through VIAs in PCB design, presented by Yuriy Shlepnev. Dive into various examples including single-ended and differential pair configurations with different numbers of stitching VIAs. Learn about VIA Analyzer tools, post-layout analysis techniques, and methods for changing VIA impedance. Gain insights into optimal stitching VIA placement and quantity, as well as return current behavior. Conclude with information about the software used for these simulations and its pricing.