Learn about card edge interconnect solutions in this 16-minute technical presentation that explores connectivity options across standard device form factors including OCP NIC, DC-SCM, EDSFF, OAI-EXP, DC-MHS, and SFF-TA-1034. Dive into the key tradeoffs when selecting card edge connectivity solutions, examining configuration options, mechanical robustness, and signal integrity performance. Explore various OCP device form factors and their connectivity implementations, with detailed coverage of tolerances, cable attachment methods, and support for high-speed, power, and sideband signals. Gain insights into compatibility with PCIe Gen 5 and 6 standards as well as CXL technology through expert analysis from TE Connectivity's Christopher Blackburn.